Schouw & Co has patented a method for creating a spunbond nonwoven laminate with multiple layers of crimped continuous filaments. The filaments have varying degrees of crimping and are composed of multicomponent materials. The method involves specific steps to ensure the desired properties of the laminate. GlobalData’s report on Schouw & Co gives a 360-degree view of the company including its patenting strategy. Buy the report here.

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According to GlobalData’s company profile on Schouw & Co, was a key innovation area identified from patents. Schouw & Co's grant share as of February 2024 was 56%. Grant share is based on the ratio of number of grants to total number of patents.

Spunbond nonwoven laminate with crimped multicomponent filaments

Source: United States Patent and Trademark Office (USPTO). Credit: Schouw & Co AS

The granted patent (Publication Number: US11898283B2) discloses a method for producing a laminate with multiple stacked spunbond nonwoven layers. The method involves creating these layers using crimped continuous filaments with varying degrees of crimping, each layer consisting of multicomponent filaments with specific plastic components. The molecular weight distribution of the plastic components is also carefully controlled to achieve desired properties in the final laminate.

Furthermore, the method includes steps for adjusting the melt flow rate, molecular weight distribution, and melting point differences between the plastic components to further enhance the characteristics of the spunbond nonwoven layers. The patent also details the use of supply units and spinning pumps to regulate the output rate of the plastic components during production, allowing for the variation of crimping in the layers. Additionally, the method involves calendering the laminate and controlling the transfer process from conveyor to calender to ensure optimal results. Overall, the patent outlines a comprehensive process for creating high-quality laminates with specific material properties and structural characteristics.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.